Flip COB is the future of display!
1.COB concept
COB, is the abbreviation of Chips on Board in English. This technology originated in the 1960s and is an "electrical design" dedicated to simplifying the packaging structure of ultra-fi...
GOB process introduction
1. GOB Process Concept
GOB is the English abbreviation of GLUE ON THE BOARD board glue, GOB process is a new type of optical thermal conductive nano-filling material, through a special process to e...